TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience.
Teardown: Lenovo Mirage VR S3 headset Virtual reality (VR) headsets have taken off in recent years after remaining stagnant due to more content becoming available for users to enjoy both movies, games and other entertainment forms. With the inception
Teardown: Apple Macbook Pro 16 While Apple may be most famous for its handheld internet-enabled devices, its Macbook Pro line has been a steady supply of revenue for the company for many years. The Macbook Pro has been a staple for many corporate IT
Oppo Find X5 Pro improves Anti-Shake Technology with 5 axis image stabilization John Scott-Thomas The Oppo Find X5 Pro was released in March, 2022 and introduce 5 axis optical image stabilization. This allows a putative x3 improvement in anti-shake
Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that
Teardown: Lenovo ThinkPad X1 Fold laptop Foldable electronics are growing in number but remain a niche market overall. Consumers are interested in the technology but the practicality of using foldable electronics is something that just hasn’t caught
In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage (650 V) devices looking to enter the light industrial and even automotive markets.
Micron, and now other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital (WD) have finished the risky product stage and just moved onto the high-volume product stage with a higher yield for SSD application. Dr. Jeongdong Choe compares each.
New ROHM 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance. Download the product brief for more details, and for a high-resolution image showing the trench structure with annotations.
Having a true end-to-end, modem-to-antenna solution and capitalizing on the benefits of having developed class-leading mobile applications with integrated baseband (BB) processors/modems, there is nothing missing from Qualcomm’s portfolio.