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澳洲幸运10官网开奖结果体彩视频 168澳洲幸运10官方开奖历史结果体彩 Latest Posts From Our Blogs

Linley Fall Processor Conference 2022
TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience.
Teardown: Lenovo Mirage VR S3 headset
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Oppo Find X5 Pro improves Anti-Shake Technology with 5 axis image stabilization
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Teardown: Samsung Galaxy Z Fold 5G
Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that
Teardown: Lenovo ThinkPad X1 Fold laptop
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This report presents a digital floorplan analysis (DFR) of the Gyrfalcon Technology Lightspeeur 2803S AI Accelerator. This second-generation chip boosts performance to nearly 17 TOPS from the first generation 2801. Additionally, the company has now added IP licensing to its portfolio as synthesizable RTL or as 28 nm hard macros.
This report presents a basic floorplan analysis (BFR) of the Texas Instruments CC2651P31T0RGZR microcontroller.
This report presents a basic floorplan analysis (BFR) of the Murata SS1D14076 mmWave RF antenna, extracted from the Samsung Galaxy A53 5G smartphone.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a digital floorplan analysis (DFR) of the Ampere Computing M128-30 Altra Max TSMC 7 nm finFET server processor, and includes an analysis of the floorplan layout and standard cell libraries used in the major IP blocks, including SRAM memory usage overview.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."